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Doğu, S., Alidoustaghdam, H., Dilman, İ, Akıncı, M. N..  2020.  The Capability of Truncated Singular Value Decomposition Method for Through the Wall Microwave Imaging. 2020 IEEE Microwave Theory and Techniques in Wireless Communications (MTTW). 1:76–81.
In this study, a truncated singular value decomposition (TSVD) based computationally efficient through the wall imaging (TWI) is addressed. Mainly, two different scenarios with identical and non-identical multiple scatterers behind the wall have been considered. The scattered data are processed with special scheme in order to improve quality of the results and measurements are performed at four different frequencies. Next, effects of selecting truncation threshold in TSVD methods are analyzed and a detailed quantitative comparison is provided to demonstrate capabilities of these TSVD methods over selection of truncation threshold.