Visible to the public Security Threats and Countermeasures in Three-Dimensional Integrated Circuits

TitleSecurity Threats and Countermeasures in Three-Dimensional Integrated Circuits
Publication TypeConference Paper
Year of Publication2017
AuthorsDofe, Jaya, Gu, Peng, Stow, Dylan, Yu, Qiaoyan, Kursun, Eren, Xie, Yuan
Conference NameProceedings of the on Great Lakes Symposium on VLSI 2017
Conference LocationNew York, NY, USA
ISBN Number978-1-4503-4972-7
Keywords3d security, hardware attacks, Hardware Trojans, Human Behavior, monolithic 3d ics, network on chip security, pubcrawl, resilience, Resiliency, Scalability, side-channel attacks, supply chain, supply chain security, through-silicon-via

Existing works on Three-dimensional (3D) hardware security focus on leveraging the unique 3D characteristics to address the supply chain attacks that exist in 2D design. However, 3D ICs introduce specific and unexplored challenges as well as new opportunities for managing hardware security. In this paper, we analyze new security threats unique to 3D ICs. The corresponding attack models are summarized for future research. Furthermore, existing representative countermeasures, including split manufacturing, camouflaging, transistor locking, techniques against thermal signal based side-channel attacks, and network-on-chip based shielding plane (NoCSIP) for different hardware threats are reviewed and categorized. Moreover, preliminary countermeasures are proposed to thwart TSV-based hardware Trojan insertion attacks.

Citation Keydofe_security_2017