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IEEE International Conference on Industrial Cyber-Physical Systems (ICPS 2019)

May 6-9, 2019 | Taipei, Taiwan |

The aim of the IEEE International Conference on Industrial Cyber-Physical Systems and IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, are to provide a platform to exchange research and innovation results, lessons learned from industrial practices associated with new paradigms and technologies. IEEE ICPS 2019 and IEEE MFI 2019 are going to be the conference series presenting the state of the art and future perspectives of Industrial Cyber-Physical Systems and Multisensor Fusion and Integration for Intelligent Systems. The industry experts, researchers, and academics share ideas and experiences surrounding frontier technologies, breakthrough and innovative solutions and applications, pertaining to

  • How Industrial Cyber-Physical Components, Systems, and Services are designed, implemented, deployed and operated by the industry.
  • How they communicate and cooperate with each other as well as humans in real time.
  • How they are in conjunction with the Internet-of-Services and real-time analytics on Big Data, enhancing internal and cross-organizational engineering, management, control and automation functionalities for all stakeholders across a digitized value-chain.

Important Deadlines

  • Special Session proposals January 18, 2019
  • Paper Submission Deadline January 20, 2019
  • Notification of acceptance March 1, 2019
  • Tutorial and Workshop proposals April 1, 2019
  • Final paper submission Deadline April 1, 2019

Submission of Papers for Review

Prospective authors are invited to submit full papers to ICPS2019 before January 20, 2019. The papers should be written in English, double column, 6 pages (An additional over length fee is required for each page in excess of 6 pages) and formatted in ieee/conferences/publishing/. Accepted Papers will be included in the IEEE Xplore digital library and indexed by EI/Compendex.

Please click HERE to go to 2019 IEEE ICPS Manuscript Submission System & 2019 IEEE MFI Manuscript Submission System

** For the paper submission, if you have any question or need help, please contact with Prof. Andres A. Nogueiras Melendez, or Secretariat of ICPS2019

Organizing Committee

General Chair

  • Ren C. Luo, National Taiwan University, Taiwan

General Co-Chairs

  • Armando W. Colombo,University of Applied Sciences Emden/Leer, Germany
  • Stamatis Karnouskos,SAP, Germany
  • Yang Shi, University of Victoria, Canada

Technical Program Chair

  • Antonio Luque Estepa, Universidad de Sevilla, Spain

Technical Program Co-Chairs

  • Jose Martinez Lastra, Tampere University of Technology, Finland
  • Shiyan Hu, Michigan Technological University, USA
  • Luis Gomes, Universidade Nova de Lisboa, Portugal
  • Ching-Chih Tsai, National Chung Hsing University, Taiwan
  • Frank Golatowski, University of Rostock, Germany
  • Shen Yin, Harbin Institute of Technology, China

Special Sessions Chairs

  • Kim Man, City University of Hong Kong
  • Chun-Hung Chen, George Mason University, USA
  • Chung-Hsien Kuo, National Taiwan University of Science and Technology, Taiwan

Publicity Chairs

  • Xinghuo Yu, RMIT University, Australia
  • Milos Manic, Virginia Commonwealth University, USA

Publication Chairs

  • Huei Yung Lin, National Chung Cheng University, Taiwan
  • Juan Jose Rodriguez-Andina, University of Vigo, Spain
  • Kao-ShingHwang,National Sun Yat-sen University, Taiwan

Finance Chair

  • Long-Yeu Chung, CNUPS, Taiwan

Local Arrangement Chair

  • Ping-Lang Yen,National Taiwan University, Taiwan
  • Chao-Lung Yang, National Taiwan University of Science and Technology, Taiwan