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32nd IEEE International System-on-Chip Conference (SOCC 2019)

September 3-6, 2019 | Singapore |

Multibillion transistor System on Chip (SoC) devices, comprised of RF, analog, optical, digital and Micro- Electro-Mechanical Systems (MEMS), are integral parts of ubiquitous communication, entertainment, medical, logistics and carrier products. SoC has been the enabling technology and main thrust behind the evolution of the Internet into a global communication and economic paradigm. Recent advances in systems, deep-submicron and nano process technology are unleashing new opportunities, and also new challenges. These challenges include managing design and verification complexity, EDA tools, on-chip communication, design reuse, handling inevitable faults and the efficient integration of emerging MEMS and nano components into next generation SoCs.

For more than 30 years the IEEE International System-on-Chip Conference (SOCC) has been the premier forum for sharing the latest advancements in SoC architecture, systems, logic and circuit design, process technology, test, design tools, and applications. We continue this tradition with the 2019 conference in Singapore.

Key Dates

  • Regular paper submission: March 30, 2019
  • Design Track extended abstract due: March 30, 2019
  • Special session proposal submission: March 30, 2019
  • Workshop/tutorial proposal submission: March 30, 2019
  • Notification of acceptance: June 24, 2019
  • Final camera-ready paper due: July 12, 2019

Three-day technical program featuring oral and poster presentations
Distinguished Speakers from industry & academia giving keynotes & plenary speeches
Full day of tutorials on SoC design and emerging technologies
Panel discussion with top experts on a hot SoC topic
Design Track for engineers in industry
Special Sessions on selected critical and emerging topics in SoC technology.
Social Events with banquet dinner, reception, and more...

Areas of Interest
Papers are invited which address new and previously unpublished results in all areas related to SoC, including but not limited to:

  • Circuits and Systems: RF, analog, mixed-signal -- Biomedical -- Wireline & wireless communication -- Digital signal processing (DSP) -- Memory systems -- Reconfigurable and programmable circuits
  • Low Power Design: "Green" circuits & systems -- Low power methodologies -- Power/energy/ thermal aware architecture design -- Multi-domain power/energy management -- Energy harvesting
  • MPSoC Architectures: On-chip interconnect -- Network on Chip (NoC) and multicore architectures -- Memory architecture for multicore computing -- 3D-IC -- Heterogeneous computing -- Parallel programming and software models
  • Design Methodologies: HW-SW co-design, reconfiguration and debug -- System level design methodology and tools -- Heterogeneous design flows -- Design validation and verification -- Design for Testability, test synthesis, embedded test
  • Application Specific Design: SoC for automotive systems -- Embedded computing and Internet of Things (IoT) -- High-performance mobile SoCs -- Security -- Real-time, high reliability and safety SoCs -- Imaging and Vision -- Cloud Solutions
  • Emerging and Evolutionary Solutions: Many-core architectures -- General purpose GPU (GPGPU) computing -- FPGA accelerated computing -- Server on a Chip -- Cortical processors -- Neuronal and neuromorphic computing -- Quantum computing -- Futuristic development and optimization tools.
  • SoCs for IoT and AI: Evolvable and reconfigurable architecture -- Self-Healing SoCs architecture for intelligent hardware system -- On-chip learning and adaptation -- Low-power and low-area SoCs for IoT .

Submission of Papers and Workshop/Tutorial/Special Session Proposals

Regular and Design Track Papers:

  • Regular Papers : limited to six double-column IEEE formatted pages.
  • Design Track Papers: two-page extended abstract.

All submissions will receive a double-blind peer review.
Accepted papers presented at the conference will be included in the SOCC proceedings and will be published in IEEE Xplore(r). Al papers must be submitted through our web site.

  • Workshop/Tutorial Proposals: Must include title, one-page abstract/summary, and speaker's bio. All proposals must be submitted directly to
  • Special Session Proposals: Must include title, topic rationale, organizer's short bio, and a list of contributed papers. Proposals must be submitted directly to



All papers must be in English, and submitted in PDF format through this web page.
Please comply with the following guidelines.
In certain cases, non-compliance may lead to paper rejection, exclusion from publication, and/or corrective actions.

The paper must discuss only new and previously unpublished results.
The paper must be formatted according to the IEEE Manuscript Templates for Conference Proceedings, have a minimum of four pages, and must not exceed 6 pages, including figures and references.
The paper must address at least one category specified in the Call for Papers.
SOCC conducts a double-blind peer review process. In submitting your manuscript for the review process, you must leave the author and affiliation section in the manuscript blank. Also, you must remove any information in the manuscript that refers to the author identity or affiliation (such as acknowledgements). Submissions not respecting the blind review requirements will be rejected.
SOCC conducts a plagiarism check on all submitted papers. Plagiarism and self-plagiarism applies to all previously published work, irrespective of whether the other publication is inside or outside of IEEE.
Multiple submissions of the same paper or a paper with substantial overlap is not allowed. If the authors alert the program chair that a submitted paper is under review elsewhere (with either an IEEE or non-IEEE publication), they will be asked to withdraw other versions from consideration or withdraw the SOCC paper. If the program chair is not alerted, a duplicate submission will be considered self-plagiarism and will be immediately rejected. Duplicate submissions without citing an author's previous work are subject to sanctions by CASS and by IEEE that may lead to exclusion from submitting new manuscripts to IEEE publications for the period of one year.
All forms of author misconduct are unacceptable and may be subject to corrective actions by the IEEE and its entities. For more information on plagiarism and multiple submissions, please refer to the Policy and Procedures of the IEEE Circuits and Systems Society.

Each accepted paper is required to have at least one "Full Conference" (member or non-member) registration paid by July 12, 2019, from one of the authors. Student or IEEE life member registrations will not be counted towards this requirement. For authors with multiple accepted papers, one full registration is valid for up to 3 papers.

All papers that are accepted must be presented at the conference, either by the authors themselves, or via a proxy capable of answering questions regarding the presented work. For Poster presenters, physical presence is required throughout the poster session. In case a paper (oral or poster) is not presented at the conference, it shall be deemed a "no-show." No-shows will be removed from post-conference distribution and will not be available on IEEE Xplore(r) or other public-access IEEE forums.

In order to achieve the same appearance for all manuscripts, SOCC requires the usage of the IEEE Manuscript Templates for Conference Proceedings, available in Microsoft Word and LaTeX format. Please do only use the US Letter size templates. A4 size will not be accepted by the system.

A pdf file should be prepared using the following guidelines:

  • Do not set any file security on any files.
  • Do not use other fonts than the ones used in the template. However, if it should become necessary for any reason to use any other font, avoid the usage of non-English fonts, especially Asian fonts.
  • ALL fonts must be accurately included in the PDF file as an "Embedded Subset."

Paper submission is done via the EDAS Conference and Journal Management System.

Submission page:

Organizing Committee

General Chair

  • Magdy Bayoumi, University of Louisiana at Lafayette, USA

General Co-Chair

  • Gwee Bah Hwee, Nanyang Technological University, Singapore

Technical Program Chair

  • Danella Zhao, Old Dominion University, USA

Technical Program Chair

  • Arindam Basu, Nanyang Technological University, Singapore