Visible to the public Integrated High Power Micro Magnets for MEMS Sensors and Actuators

TitleIntegrated High Power Micro Magnets for MEMS Sensors and Actuators
Publication TypeConference Paper
Year of Publication2019
AuthorsLisec, Thomas, Bodduluri, Mani Teja, Schulz-Walsemann, Arne-Veit, Blohm, Lars, Pieper, Isa, Gu-Stoppel, Shanshan, Niekiel, Florian, Lofink, Fabian, Wagner, Bernhard
Conference Name2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems Eurosensors XXXIII (TRANSDUCERS EUROSENSORS XXXIII)
Date Publishedjun
Keywordsback-end-of-line compatible integration, boron alloys, cleanroom environment, compositionality, elemental semiconductors, integrated high power micromagnets, iron alloys, Magnetic flux, magnetic MEMS, magnetic resonance imaging, Magnetic separation, MEMS sensors, Micro magnets, microactuators, micromagnet arrangements, Micromechanical devices, microsensors, neodymium alloys, permanent magnetic structures, Permanent magnets, pubcrawl, remanence, remanent magnetization, Resiliency, Resists, Si-NdFeB, Silicon, silicon frames, size 25.0 mum to 2000.0 mum, size 8.0 inch, substrate conditioning procedures, Substrates, Surface treatment
AbstractBack-end-of-line compatible integration of NdFeB-based micro magnets onto 8 inch Si substrates is presented. Substrate conditioning procedures to enable further processing in a cleanroom environment are discussed. It is shown that permanent magnetic structures with lateral dimensions between 25mm and 2000mm and a depth up to 500mm can be fabricated reliably and reproducibly with a remanent magnetization of 340mT at a standard deviation as low as 5% over the substrate. To illustrate post-processing capabilities, the fabrication of micro magnet arrangements embedded in silicon frames is described.
Citation Keylisec_integrated_2019