37th IEEE International System-on-Chip Conference (SOCC 2024)
Date: Sep 16, 2024 6:00 am – Sep 19, 2024 4:00 pm
Location: Dresden, Germany
The 37th SOCC offers a three days technical program including keynote and plenary speeches, oral and poster presentations, hot-topic panel sessions, and one day of tutorials and industrial talks.
In addition, SOCC has a long tradition of high-class social events complementing the technical program, helping you to discuss your work with your colleagues, and enhancing your professional network.
System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies underpinning emerging “Digital Societies”. Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices, various accelerators, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage, memory, security, reliability, power, on- and off-chip communication, packaging including reliable design and verification.
Distinguished Speakers
Distinguished Engineer for SoC Architectures
Infineon Technologies AG
Chair for Microelectronic System Design
University of Kaiserslautern-Landau
And more...
Submitted by Amy Karns
on
The 37th SOCC offers a three days technical program including keynote and plenary speeches, oral and poster presentations, hot-topic panel sessions, and one day of tutorials and industrial talks.
In addition, SOCC has a long tradition of high-class social events complementing the technical program, helping you to discuss your work with your colleagues, and enhancing your professional network.
System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies underpinning emerging “Digital Societies”. Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices, various accelerators, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage, memory, security, reliability, power, on- and off-chip communication, packaging including reliable design and verification.
Distinguished Speakers
Distinguished Engineer for SoC Architectures
Infineon Technologies AG
Chair for Microelectronic System Design
University of Kaiserslautern-Landau
And more...