NSF Awards $3M to Launch 3D Chip Design Hub at UChicago

The U.S. National Science Foundation has awarded $3 million to establish the NSF ACE-3D Chip Design Hub at the University of Chicago, a national center to accelerate domestic semiconductor innovation. Led by Farah Fahim (UChicago Pritzker School of Molecular Engineering and Fermilab), the hub will tackle barriers in chip design and strengthen the U.S. workforce pipeline for next-generation semiconductor manufacturing.

Key Goals & Impacts:

  • Revolutionize chip design with vertically stacked 3D chips.

  • Provide accessible design flows, assembly kits, and curricula for researchers and students nationwide.

  • Build collaborations across academia, industry, and national labs to expand innovation capacity.

  • Train a skilled workforce to sustain U.S. leadership and competitiveness in microelectronics.

    “By giving academia access to advanced manufacturing resources, we can propel manufacturing efforts across the country,” -Farah Fahim.

Partners include Northwestern, University of Illinois Urbana-Champaign, Arizona State, Minnesota, UCLA, and industry leaders like Synopsys and NHanced Semiconductors. The hub complements Purdue’s Chipshub, together forming the backbone of the NSF Chip Design Hub program.

Full article linked here. 

Submitted by Jason Gigax on
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