REES 2015
Date: Oct 08, 2015 1:00 am – Oct 08, 2015 10:00 am
Location: Amsterdam, The Netherlands
1st International ESWEEK Workshop on Resiliency in Embedded Electronic Systems (REES 2015)
With the sheer complexity of hardware and software systems, resiliency became a major challenge in embedded systems design, manufacturing, and operation. For industrial applications several standards such as ISO26262, IEC61508 or DO-254 prescribe a well-defined level of reliability, robustness, and fault-tolerance.
This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows,
like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.
General Co-Chairs
- Daniel Müller-Gritschneder, Technical University of Munich, Germany
- Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
- Subhasish Mitra, Stanford University CA, USA
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1st International ESWEEK Workshop on Resiliency in Embedded Electronic Systems (REES 2015)
With the sheer complexity of hardware and software systems, resiliency became a major challenge in embedded systems design, manufacturing, and operation. For industrial applications several standards such as ISO26262, IEC61508 or DO-254 prescribe a well-defined level of reliability, robustness, and fault-tolerance.
This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows,
like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.
General Co-Chairs
- Daniel Müller-Gritschneder, Technical University of Munich, Germany
- Wolfgang Müller, Heinz Nixdorf Institute/University of Paderborn, Germany
- Subhasish Mitra, Stanford University CA, USA