RSP 2016
Date: Oct 06, 2016 4:45 pm – Oct 07, 2016 5:45 pm
Location: Pittsburgh, PA
27th IEEE International Symposium on Rapid System Prototyping (RSP 2016)
as part of ESWeek
The IEEE International Symposium on Rapid System Prototyping (RSP) emphasizes design experience sharing and collaborative approach between hardware and software research communities from industry and academy. It considers prototyping as an iterative design approach for embedded hardware and software systems. The RSP series of symposium aim at bridging the gaps in embedded system design between applications, architectures, tools, and technologies to achieve rapid system prototyping of emerging software and hardware systems.
For its 27th venue, the Rapid System Prototyping symposium seeks original contributions related to this target, encompassing a wide scope ranging from formal methods for the verification of software and hardware systems to case studies of emerging embedded systems and technologies. The symposium proposes a two-day inspiring international forum for discussing the latest related innovations and research activities. The symposium program will include keynote speeches and technical papers on timely topics. The RSP symposium continues as a part of the Embedded Systems Week that will be held this year in Pittsburgh, PA, USA. See http://www.esweek.org for more details.
Suggested topics include, but are not limited to:
- Rapid prototyping and emulation methods and tools
- Specification models and methodologies for hardware/software systems
- Emerging technologies, devices, boards, and applications
- Prototyping experiences related to emerging technologies (memories, 3D integration, next generation wireless, IoT)
- Prototyping of embedded systems for real-time, low power, and flexibility
- Hardware and software platforms for IoT systems
- Middleware for embedded systems
- Model-driven engineering and prototyping
- Reliability and failure analysis for embedded systems
- Formal methods and verification/validation of embedded systems
- Embedded system virtualization
- Virtual prototyping and platforms for embedded systems
- Prototyping methods and tools for reconfigurable computing
- Rapid design approaches for application-specific processors
- MPSoC and GPU-based system design and challenges
- Hardware platforms and approaches for simulations acceleration
- Industrial experiences in embedded system prototyping
The program committee invites authors to submit original unpublished full papers. Authors of selected papers will be requested to prepare a final camera-ready manuscript for the symposium proceedings and must register and attend the symposium for their paper to be published. Each technical paper must be associated with an author registration at full rate. Paper length should not exceed 7 pages and should use the standard IEEE format. Accepted and presented papers will be included in the IEEE RSP 2016 symposium proceedings and published in IEEE Xplore.
For any related question, please contact the organization committee:
- Amer Baghdadi, Telecom Bretagne/Lab-STICC (Amer.Baghdadi@telecom-bretagne.eu)
- Fabiano Hessel, PUCRS (Fabiano.Hessel@pucrs.br)
- Frédéric Rousseau, TIMA (Frederic.Rousseau@imag.fr)
Submitted by Anonymous
on
27th IEEE International Symposium on Rapid System Prototyping (RSP 2016)
as part of ESWeek
The IEEE International Symposium on Rapid System Prototyping (RSP) emphasizes design experience sharing and collaborative approach between hardware and software research communities from industry and academy. It considers prototyping as an iterative design approach for embedded hardware and software systems. The RSP series of symposium aim at bridging the gaps in embedded system design between applications, architectures, tools, and technologies to achieve rapid system prototyping of emerging software and hardware systems.
For its 27th venue, the Rapid System Prototyping symposium seeks original contributions related to this target, encompassing a wide scope ranging from formal methods for the verification of software and hardware systems to case studies of emerging embedded systems and technologies. The symposium proposes a two-day inspiring international forum for discussing the latest related innovations and research activities. The symposium program will include keynote speeches and technical papers on timely topics. The RSP symposium continues as a part of the Embedded Systems Week that will be held this year in Pittsburgh, PA, USA. See http://www.esweek.org for more details.
Suggested topics include, but are not limited to:
- Rapid prototyping and emulation methods and tools
- Specification models and methodologies for hardware/software systems
- Emerging technologies, devices, boards, and applications
- Prototyping experiences related to emerging technologies (memories, 3D integration, next generation wireless, IoT)
- Prototyping of embedded systems for real-time, low power, and flexibility
- Hardware and software platforms for IoT systems
- Middleware for embedded systems
- Model-driven engineering and prototyping
- Reliability and failure analysis for embedded systems
- Formal methods and verification/validation of embedded systems
- Embedded system virtualization
- Virtual prototyping and platforms for embedded systems
- Prototyping methods and tools for reconfigurable computing
- Rapid design approaches for application-specific processors
- MPSoC and GPU-based system design and challenges
- Hardware platforms and approaches for simulations acceleration
- Industrial experiences in embedded system prototyping
The program committee invites authors to submit original unpublished full papers. Authors of selected papers will be requested to prepare a final camera-ready manuscript for the symposium proceedings and must register and attend the symposium for their paper to be published. Each technical paper must be associated with an author registration at full rate. Paper length should not exceed 7 pages and should use the standard IEEE format. Accepted and presented papers will be included in the IEEE RSP 2016 symposium proceedings and published in IEEE Xplore.
For any related question, please contact the organization committee:
- Amer Baghdadi, Telecom Bretagne/Lab-STICC (Amer.Baghdadi@telecom-bretagne.eu)
- Fabiano Hessel, PUCRS (Fabiano.Hessel@pucrs.br)
- Frédéric Rousseau, TIMA (Frederic.Rousseau@imag.fr)