ICESS 2017
Date: Mar 06, 2017 3:45 pm – Mar 06, 2017 4:45 pm
Location: Sydney, Austrailia
14th IEEE International Conference on Embedded Software and Systems (ICESS 2017)
Sydney, Australia | August 1-4, 2017 | http://www.stprp-activity.com/ICESS2017
Co-Located with IEEE TrustCom and IEEE BigDataSE
IMPORTANT DATES
- Paper submission deadline: April 15, 2017
- Notification of acceptance: May 15, 2017
- Final paper submission: June 1, 2017
As the fastest growing industry, embedded systems have great societal and environmental impacts.
Embedded software and systems, ranging from smart appliances to unmanned trains/vehicles, have been crucial in our daily life. Therefore, the design and implementation of safe and efficient embedded software and systems are of utmost importance. IEEE ICESS is an international forum for researchers and developers from academia, industry and government to present and discuss the science, engineering, technology and emerging ideas and trends of embedded software and systems.
The ICESS-2017 conference is the 14th IEEE International Conference on Embedded Software and Systems. It provides an international forum for presenting and discussing emerging ideas and trends in embedded software and systems from both the research community as well as the industry. ICESS-2017 is sponsored by IEEE, IEEE Computer Society, and IEEE Technical Committee on Scalable Computing (TCSC).
TOPIC AREAS FOR SUBMISSION
Within the scope of the conference, the main areas of interest are organized in the following tracks.
Submissions can be made to any of the track topics.
1. Systems, Models and Algorithms Track
- Embedded System Architecture
- Embedded Software Architectures
- Embedded OS, Scheduling and Runtime Support
- Embedded Storage and I/O Systems
- Real-Time Embedded Systems
- Distributed and Networked Embedded Systems
- Fault Tolerant and Trusted Embedded Systems
- Mixed-Criticality Embedded Systems
- Heterogeneous SoC and Multicore Embedded Systems
- Power and Thermal Aware Computing
- Pervasive/Ubiquitous Computing
- Reconfigurable Embedded Computing
2. Design Methodology and Tools Track
- Design Technologies of Embedded Systems
- Formal Methods for Embedded Systems
- Middleware for Embedded Systems
- IDE and Software Tools
- Hardware/Software Co-Design
- Component-Based Embedded Software Design
- Model-based Design for Embedded Software
- Domain/Application-Specific Design Techniques
- Testing Techniques for Embedded Software/Systems
- Verification and Validation for Embedded Systems
- Compilation and Debug Techniques and Tools
- Performance Evaluation Techniques and Tools
3. Emerging Embedded Applications and Interdisciplinary Topics Track
- Intelligent Embedded Systems
- Internet-of-Things (IoT)
- Wearable Devices
- Smart City
- Robotics and Control Systems
- Wireless Sensor Networks (WSN)
- Cyber-Physical Systems (CPS)
- Robotics and Control Systems
- Embedded Automotive, Medical and Avionics Systems
- Embedded Database & Multimedia Systems
- QoS Support for Embedded Systems
- Embedded Network Protocol and Security
- Emergency and Disaster Management
- Consumer Electronics
- Mobile Cloud Computing
- Industrial Practices and Case Studies
SUBMISSIONS
Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5" x 11", Two-Column). Each submission should be limited to 10 pages.
Accepted regular papers will have 8 complimentary pages with registration (or up to 10 pages with over-length charge). Accepted short papers will have 4 complimentary pages with registration (or up to 6 pages with over-length charge). All paper submissions must represent original and unpublished work. Papers must be submitted electronically in PDF format through EasyChair (please refer to the conference website for additional information).
The accepted papers from this conference will be published by IEEE Computer Society in IEEE proceedings (indexed by EI Compendex). Distinguished papers, after further revisions, will be considered for possible publication in several SCI & EI indexed special issues of prestigious international journals. By submitting a paper to the conference, authors assure that if the paper is accepted, at least one author will attend the conference and present the paper.
ORGANIZING COMMITTEE
General Chairs
- Daniel Mosse, University of Pittsburgh, USA
- Sudeep Pasricha, Colorado State University, USA
Program Chairs
- Tam Chantem, Virginia Tech, USA
- Nan Guan, Hong Kong Polytechnic University, China
- Duo Liu, Chongqing University, China
Track Chairs
- Song Han, University of Connecticut, USA
- Abusayeed Saifullah, Wayne State University, USA
- Yi Wang, Shenzhen University, China
Steering Chairs
- Zhaohui Wu, Zhejiang University, China
- Laurence T. Yang, St. Francis Xavier University, Canada
Steering Committee
- Yann-Hang Lee, Arizona State University, USA
- Xiangke Liao, National University of Defence Technology, China
- Edwin Sha, Chongqing University, China
- Xingshe Zhou, Northwestern Polytechnical University, China
- Sandeep K Shukla, Indian Institute of Technology Kanpur, India
- Dakai Zhu, University of Texas at San Antonio, USA
- Zili Shao, Hong Kong Polytechnic University, China
Workshop and Tutorial Chairs
- Haibo Zhang, University of Otago, New Zealand
- Nenggan, Zheng, Zhejiang University, China
Publicity Chairs
- Chunsheng Zhu, University of British Columbia, Canada
- Qingchen Zhang, St Francis Xavier University, Canada
- Wenbin Jiang, Huazhong University of Science and Technology, China
Publication Chair
- Gengfa Feng - University of Technology Sydney, Australia
Finance Chair
- Wenjing Jia - University of Technology Sydney, Australia
Web Chair
- Ashish Nanda - University of Technology Sydney, Australia
PROGRAM COMMITTEE
1. Systems, Models and Algorithms Track
Chair
- Song Han, University of Connecticut, USA
Technical Program Committee
- Jian-Jia Chen, Technical University of Dortmund, Germany
- Petru Eles, Linkoping University, Sweden
- Jingtong Hu, Oklahoma State University, USA
- Lei Ju, Shandong University, China
- Fanxin Kong, University of Pennsylvania, USA
- Jinkyu Lee, Sungkyunkwan University, Republic of Korea
- Yongpan Liu, Tsinghua University, China
- Richard West, Boston University, USA
2. Design Methodology and Tools Track
Chair
- Abusayeed Saifullah, Wayne State University, USA
Technical Program Committee
- Bjorn Andersson, Carnegie Mellon University, USA
- Jalil Boukhobza, University of Occidental Brittary, France
- Qingxu Deng, Northeastern University, China
- Marco Di Natale, Scuola Superiore Sant'Anna, Italy
- Sibin Mohan, University of Illinois UC, USA
- Morteza Mohaqeqi, Uppsala University, Sweden
- Geoffrey Nelissen, CISTER/INESC TEC ISEP, Portugal
- Chengmo Yang, University of Delaware, USA
3. Emerging Embedded Applications and Interdisciplinary Topics Track
Chair
- Yi Wang, Shenzhen University, China
Technical Program Committee
- Yuan-Hao Chang, Academia Sinica, Taiwan
- Renhai Chen, Tianjin University, China
- Zonghua Gu, Zhejiang University, China
- Lei Jiang, Indiana University Bloomington, USA
- Vincent Nelis, CISTER/INESC TEC ISEP, Portugal
- Christian Poellabauer, University of Notre Dame, USA
- Keni Qiu, Capital Normal University, China
- Qinru Qiu, Syracuse University, USA
- Guangyu Sun, Peking University, China
- Wujie Wen, Florida International University, USA
Submitted by Anonymous
on
14th IEEE International Conference on Embedded Software and Systems (ICESS 2017)
Sydney, Australia | August 1-4, 2017 | http://www.stprp-activity.com/ICESS2017
Co-Located with IEEE TrustCom and IEEE BigDataSE
IMPORTANT DATES
- Paper submission deadline: April 15, 2017
- Notification of acceptance: May 15, 2017
- Final paper submission: June 1, 2017
As the fastest growing industry, embedded systems have great societal and environmental impacts.
Embedded software and systems, ranging from smart appliances to unmanned trains/vehicles, have been crucial in our daily life. Therefore, the design and implementation of safe and efficient embedded software and systems are of utmost importance. IEEE ICESS is an international forum for researchers and developers from academia, industry and government to present and discuss the science, engineering, technology and emerging ideas and trends of embedded software and systems.
The ICESS-2017 conference is the 14th IEEE International Conference on Embedded Software and Systems. It provides an international forum for presenting and discussing emerging ideas and trends in embedded software and systems from both the research community as well as the industry. ICESS-2017 is sponsored by IEEE, IEEE Computer Society, and IEEE Technical Committee on Scalable Computing (TCSC).
TOPIC AREAS FOR SUBMISSION
Within the scope of the conference, the main areas of interest are organized in the following tracks.
Submissions can be made to any of the track topics.
1. Systems, Models and Algorithms Track
- Embedded System Architecture
- Embedded Software Architectures
- Embedded OS, Scheduling and Runtime Support
- Embedded Storage and I/O Systems
- Real-Time Embedded Systems
- Distributed and Networked Embedded Systems
- Fault Tolerant and Trusted Embedded Systems
- Mixed-Criticality Embedded Systems
- Heterogeneous SoC and Multicore Embedded Systems
- Power and Thermal Aware Computing
- Pervasive/Ubiquitous Computing
- Reconfigurable Embedded Computing
2. Design Methodology and Tools Track
- Design Technologies of Embedded Systems
- Formal Methods for Embedded Systems
- Middleware for Embedded Systems
- IDE and Software Tools
- Hardware/Software Co-Design
- Component-Based Embedded Software Design
- Model-based Design for Embedded Software
- Domain/Application-Specific Design Techniques
- Testing Techniques for Embedded Software/Systems
- Verification and Validation for Embedded Systems
- Compilation and Debug Techniques and Tools
- Performance Evaluation Techniques and Tools
3. Emerging Embedded Applications and Interdisciplinary Topics Track
- Intelligent Embedded Systems
- Internet-of-Things (IoT)
- Wearable Devices
- Smart City
- Robotics and Control Systems
- Wireless Sensor Networks (WSN)
- Cyber-Physical Systems (CPS)
- Robotics and Control Systems
- Embedded Automotive, Medical and Avionics Systems
- Embedded Database & Multimedia Systems
- QoS Support for Embedded Systems
- Embedded Network Protocol and Security
- Emergency and Disaster Management
- Consumer Electronics
- Mobile Cloud Computing
- Industrial Practices and Case Studies
SUBMISSIONS
Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5" x 11", Two-Column). Each submission should be limited to 10 pages.
Accepted regular papers will have 8 complimentary pages with registration (or up to 10 pages with over-length charge). Accepted short papers will have 4 complimentary pages with registration (or up to 6 pages with over-length charge). All paper submissions must represent original and unpublished work. Papers must be submitted electronically in PDF format through EasyChair (please refer to the conference website for additional information).
The accepted papers from this conference will be published by IEEE Computer Society in IEEE proceedings (indexed by EI Compendex). Distinguished papers, after further revisions, will be considered for possible publication in several SCI & EI indexed special issues of prestigious international journals. By submitting a paper to the conference, authors assure that if the paper is accepted, at least one author will attend the conference and present the paper.
ORGANIZING COMMITTEE
General Chairs
- Daniel Mosse, University of Pittsburgh, USA
- Sudeep Pasricha, Colorado State University, USA
Program Chairs
- Tam Chantem, Virginia Tech, USA
- Nan Guan, Hong Kong Polytechnic University, China
- Duo Liu, Chongqing University, China
Track Chairs
- Song Han, University of Connecticut, USA
- Abusayeed Saifullah, Wayne State University, USA
- Yi Wang, Shenzhen University, China
Steering Chairs
- Zhaohui Wu, Zhejiang University, China
- Laurence T. Yang, St. Francis Xavier University, Canada
Steering Committee
- Yann-Hang Lee, Arizona State University, USA
- Xiangke Liao, National University of Defence Technology, China
- Edwin Sha, Chongqing University, China
- Xingshe Zhou, Northwestern Polytechnical University, China
- Sandeep K Shukla, Indian Institute of Technology Kanpur, India
- Dakai Zhu, University of Texas at San Antonio, USA
- Zili Shao, Hong Kong Polytechnic University, China
Workshop and Tutorial Chairs
- Haibo Zhang, University of Otago, New Zealand
- Nenggan, Zheng, Zhejiang University, China
Publicity Chairs
- Chunsheng Zhu, University of British Columbia, Canada
- Qingchen Zhang, St Francis Xavier University, Canada
- Wenbin Jiang, Huazhong University of Science and Technology, China
Publication Chair
- Gengfa Feng - University of Technology Sydney, Australia
Finance Chair
- Wenjing Jia - University of Technology Sydney, Australia
Web Chair
- Ashish Nanda - University of Technology Sydney, Australia
PROGRAM COMMITTEE
1. Systems, Models and Algorithms Track
Chair
- Song Han, University of Connecticut, USA
Technical Program Committee
- Jian-Jia Chen, Technical University of Dortmund, Germany
- Petru Eles, Linkoping University, Sweden
- Jingtong Hu, Oklahoma State University, USA
- Lei Ju, Shandong University, China
- Fanxin Kong, University of Pennsylvania, USA
- Jinkyu Lee, Sungkyunkwan University, Republic of Korea
- Yongpan Liu, Tsinghua University, China
- Richard West, Boston University, USA
2. Design Methodology and Tools Track
Chair
- Abusayeed Saifullah, Wayne State University, USA
Technical Program Committee
- Bjorn Andersson, Carnegie Mellon University, USA
- Jalil Boukhobza, University of Occidental Brittary, France
- Qingxu Deng, Northeastern University, China
- Marco Di Natale, Scuola Superiore Sant'Anna, Italy
- Sibin Mohan, University of Illinois UC, USA
- Morteza Mohaqeqi, Uppsala University, Sweden
- Geoffrey Nelissen, CISTER/INESC TEC ISEP, Portugal
- Chengmo Yang, University of Delaware, USA
3. Emerging Embedded Applications and Interdisciplinary Topics Track
Chair
- Yi Wang, Shenzhen University, China
Technical Program Committee
- Yuan-Hao Chang, Academia Sinica, Taiwan
- Renhai Chen, Tianjin University, China
- Zonghua Gu, Zhejiang University, China
- Lei Jiang, Indiana University Bloomington, USA
- Vincent Nelis, CISTER/INESC TEC ISEP, Portugal
- Christian Poellabauer, University of Notre Dame, USA
- Keni Qiu, Capital Normal University, China
- Qinru Qiu, Syracuse University, USA
- Guangyu Sun, Peking University, China
- Wujie Wen, Florida International University, USA