SIES 2018

Date: Jun 06, 2018 12:00 am – Jun 08, 2018 11:00 am
Location: Graz, Austria

13th IEEE International Symposium on Industrial Embedded Systems (SIES)

In conjunction with "2nd Symposium on Dependable Internet of Things" June 5, 2018, Graz, Austria

The IEEE Symposium on Industrial Embedded Systems (SIES) is a highly selective
single-track international conference focusing on premier research results for
embedded systems - an area of highest relevance for visionary technologies
such as the Internet of Things (IoT) and applications such as Industry 4.0,
Smart Production, Smart Cities, Connected Cars, etc.
 
The featured topic of SIES 2018 is "ICT for a Dependable Internet of Things",
where increasingly complex software and growing networks, application-specific
hardware and systems on chips (SoC) will become more and more relevant for all
related areas of industrial and consumer applications. In this regard, the IoT
promises to be one of the most disruptive technologies with transformational
impact on industry and society throughout the next decades. As a global super-
infrastructure, the IoT is a key enabling technology for a multitude of
application domains, including smart cities, smart cars, smart home, smart
health, smart factories, smart buildings, etc. However, related applications
and services are only feasible if the underlying systems do not fail and
disastrous real-world impacts are avoided, making dependability one of the main
design challenges.
 
The aim of the symposium is to bring together researchers and practitioners
from industry and academia. SIES provides a platform to report on recent
developments, deployments, technology trends and research results, as well as
to discuss and start initiatives related to embedded systems and their
applications in a variety of industrial environments.
 
Topics of interest include, but are not limited to:
- General Embedded Systems:
  Dependability Aspects; Design and Validation; Operating Systems and
  Middleware; Power Awareness; Adaptive and Compositional Systems.
- System-on-Chip and Network-on-Chip: Design & Testing; Multiprocessor Design;
  Design of Application-Specific CPU/MCU Architectures; Platform-Based Design;
  Reconfigurable Platforms; Implementation and Testing of Integrated Circuits.
- Networked Embedded Systems: Design, Dependability and Tooling; Middleware;
  Network Protocols.
- Embedded Applications: Cyber-Physical Systems and the Internet of Things;
  Domain Specific Systems (e.g., Industrial Automation and Control, Intelligent
  Transportation, Automotive, Avionics and Aerospace, Smart Home, Wireless
  Health Care, Automation and Control).
 
CO-LOCATED EVENT

SIES 2018 will be co-located with the "2nd Symposium on Dependable Internet of Things" (5 June 2018), presenting project results, talks by international experts, and an exhibition on the TU Graz LEAD
Project Dependable Internet of Things in Adverse Environments. Please visit the SIES website for further details: http://sies2018.tugraz.at/cms/index.php?id=60 Participation of free of charge for registered participants of SIES.
 
PROMOTED TALKS

SIES Conference - Keynote Presentations:
* AVL List GmbH, Graz
* TTTech Computertechnik AG, Vienna
* Elektrobit Automotive GmbH, Erlangen
 
IoT Symposium - Invited Talks:

* Lothar Thiele (Swiss Federal Institute of Technology Zurich)
  "Internet of Things - The Quest for Trust"
* Daniel Lohmann (Leibniz University Hannover)
  "Tailorable System Software for the Internet of Things: Rethinking the HW–SW Bridge"
* tba
 
IoT Symposium - Local Speakers:
* Klaus Witrisal (Dependable Localization)
  "High-accuracy Positioning in Indoor Environments"
* Marcel Baunach (Dependable Computing)
  "Compositional Computing Platforms for a Dependable Internet of Things"
* Bernhard Aichernig (Dependable Composition)
  "Smart Testing of IoT Protocols - Combining Model Learning and Model-based Testing"
* Martin Horn (Dependable Control)
  "Sliding-Mode Control for Networked Control Systems - Theory and Applications"
 
ORGANIZING COMMITTEE

General Co-Chairs:
- Marcel Baunach (TU Graz, Austria) 
- Roman Obermaisser (University of Siegen, Germany) 
 
Program Committee Co-Chairs:

- Roberto Passerone (Univ of Trento, Italy) 
- Stig Petersen (SINTEF, Norway) 
 
WiP and Posters Co-Chairs:
- Tobias Hoßfeld (University of Duisburg, Germany) 
- Haibo Zeng (VirginiaTech, USA) 
 
IEEE CEDA Representative 
- Yao-Wen Chang (National Taiwan University, Taiwan) 
 
SIES Series Steering Committee:   
- R. Ernst (TU Braunschweig, Germany)
- G. De Micheli (EPFL, Switzerland) 
- R. Gupta (UC San Diego, USA) 
- A. Sangiovanni-Vincentelli (UC Berkeley, USA) 
- R. Zurawski (ISA Group, USA)
 
International Advisory Committee:   

- J. J. Chen, Germany 
- E. Dekneuvel, UNSA, France 
- M. Di Natale, Scuola Superiore S. Anna, Italy 
- L. Gomes, Uninova, Portugal 
- T. Nolte, Mälardalen University, Sweden 
- R. Obermaisser, University of Siegen, Germany 
- R. Passerone, Univ. of Trento, Italy SIES
- G. Sassatelli, LIRM, France 
- J.-L. Scharbarg, INP-ENSEEIHT & IRIT, France 
- E. Tovar, IPP, Portugal 
- A. Vachoux, EPFL, Switzerland 
- K. Zielinski, AGH UST, Poland 
 

 

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