DATE 2019
Date: Mar 25, 2019 1:00 am – Mar 29, 2019 12:00 pm
Location: Florence, Italy
Design, Automation, and Test in Europe (DATE 2019)
The European Event for Electronic Design and Test
The 22nd DATE conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems, covering ICs/SoCs, reconfigurable hardware and embedded systems, and embedded software.
The five-day event consists of a conference with plenary invited papers, regular papers, panels, hot-topic sessions, tutorials and workshops, two special focus days and a track for executives. The scientific conference is complemented by a commercial exhibition showing the state-of-the-art in design and test tools, methodologies, IP and design services, reconfigurable and other hardware platforms, embedded software, and (industrial) design experiences from different application domains, e.g. automotive, wireless, telecom and multimedia applications. The organisation of user group meetings, fringe meetings, a university booth, a PhD forum, vendor presentations and social events offers a wide variety of extra opportunities to meet and exchange information on relevant issues for the design and test community. Special space will also be allocated for EU-funded projects to show their results.
The Conference
The conference addresses all aspects of research into technologies for electronic and (embedded) systems engineering. It covers the design process, test, and tools for design automation of electronic products ranging from integrated circuits to distributed large-scale systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecom, wireless communications, multimedia, healthcare and automotive systems. Persons involved in innovative industrial designs are particularly encouraged to submit papers to foster the feedback from design to research. Panels, hot-topic sessions and embedded tutorials highlight and inform about emerging topics.
Special Days in the programme will focus on two areas bringing new challenges to the system design community:
Embedded meets Hyperscale and HPC: Heterogeneous computing with multiple, specialized processors and application-specific accelerators is vital for embedded systems to meet performance, latency, and efficiency targets. The same goals of fast, efficient, and cost-effective processing are also gating factors for the evolution of hyperscale data centre (DC) and high-performance computing (HPC) and Moore’s law no longer provides the necessary efficiency gains. Hence, we can witness a spread of technologies pioneered in embedded systems to hyperscale DCs and HPC systems, e.g., the use of specialized computing resources, massive parallelism, model-driven and domain-specific programming, task models, co-scheduling, and others. The theme of this special day is to highlight this confluence of methods and technologies to better understand, how heterogeneous computing is shaping the future of hyperscale DCs and HPC.
Model-Based Design of Intelligent Systems: The complexity of today’s cyber-physical systems is already enormous, but the rise of intelligent systems will further accelerate the design complexity. Good models and associated design processes are needed to keep the development under control and deliver high-quality systems in time. Modelbased design places models at the centre of the development cycle. It has successfully been used to develop embedded systems, starting from models in well-defined modelling formalisms, that can be analysed and from which software and hardware realizations can be automatically generated. This special day will explore all that is needed to lift model-based design into the era of intelligent systems. The special day will address, among other things, model-based design frameworks for IoT systems, modelbased machine learning, and application of model-based design in safety-critical and autonomous systems. The special day will also highlight the upcoming challenges in this domain to invite the DATE community to help to overcome them.
On the first day of the DATE event, half-day in-depth technical tutorials are given by leading experts in their respective fields. The Monday Tutorials are well suited for researchers, tool developers and system designers.
Friday Workshops concentrate on specialised and novel topics.
The Exhibition
The vivid accompanying exhibition states a unique networking opportunity for vendors of tools and services for hardware and embedded software for the design, development and test of Systems-on-Chip, IPs, Embedded Systems, ASICs, FPGAs and PCBs. Furthermore, it states the perfect venue for industries to meet university professors to foster their university programme and especially for PhD Students to meet their future employers.
A full programme in the Exhibition Theatre will again combine presentations by exhibiting companies, best-practice reports by industry leaders on their latest design projects and selected conference special sessions.
The full list of participating exhibitors and sponsors including their company profiles can always be found online: https://www.date-conference.com/exhibitors-sponsors
Topic Areas for Submission
Within the scope of the conference, the main areas of interest are organised in the following tracks. Submissions can be made to any of the track topics.
Track D: Design Methods and Tools, addresses design automation, design tools and hardware architectures for electronic and embedded systems. The emphasis is on methods, algorithms, and tools related to the use of computers in designing complete systems. The track’s focus includes significant improvements on existing design methods and tools as well as forward-looking approaches to model and design future system architectures, design flows, and environments.
Track A: Application Design, is devoted to the presentation and discussion of design experiences with a high degree of industrial relevance, real-world implementations, and applications of specific design and test methodologies. Contributions should illustrate innovative or record-breaking designs, which will provide viable solutions in tomorrow’s silicon, embedded systems, and large-scale systems. In topic A8, there is the opportunity to submit 2-page papers that expose industrial research and practice.
This track is organised in the following topics:
- A1 Power-efficient and Sustainable Computing
- A2 Robotics and Industry 4.0
- A3 Automotive Systems and Smart Energy Systems
- A4 Augmented Living and Personalized Healthcare
- A5 Secure Systems, Circuits, and Architectures
- A6 Self-adaptive and Learning Systems
- A7 Applications of Emerging Technologies
- A8 Industrial Experiences Brief Papers
Track T: Test and Dependability, covers all test, design-for-test, relia bility, and designfor-robustness issues, at system-, chip-, circuit-, and device-level for both analogue and digital electronics. Topics of interest also include diagnosis, failure mode analysis, debug and post-silicon validation challenges, and test or fault injection methods addressing system security.
This track is organised in the following topics:
- T1 Modeling and Mitigation of Defects, Faults, Variability, and Reliability
- T2 Test Generation, Test Architectures, Design for Test, and Diagnosis
- T3 Microarchitecture-Level Dependability
- T4 System-Level Dependability
- DT5 Design and Test for Analog and Mixed-Signal Circuits and Systems, and MEMS
- DT6 Design and Test of Secure Systems
Track E: Embedded and Cyber-Physical Systems, is devoted to the modelling, analysis, design and deployment of embedded software or embedded/cyber-physical systems. Areas of interest include methods, tools, methodologies and development environments. Emphasis will also be on model-based design and verification, embedded software platforms, software compilation and integration, real-time systems, cyberphysical systems, networked systems, and dependable systems.
This track is organised in the following topics:
- E1 Real-time and Dependable Systems
- E2 Embedded Systems for Deep Learning
- E3 Model-Based Design, Verification and Security for Embedded Systems
- E4 Embedded Software Architecture, Compilers and Tool Chains
- E5 Cyber-Physical Systems Design
- In addition to the above conference tracks, we welcome proposals for Special Sessions, Monday Tutorials, and Friday Workshops, and submissions for the Special Days on Designing Electronics for the Internet of Things Era and Designing Wearable Electronics and Smart Medical Devices.
Committees
Click the links below for a full list of the executive and programme committee members:
Sponsors
The event is sponsored by the European Design and Automation Association, the Electronic System Design (ESD) Alliance, the IEEE Council on EDA, ECSI, ACM – SIGDA, and RAS.
In cooperation with IEEE Computer Society Test Technology Technical Council (TTTC), IEEE Solid-State Circuits Society (SSCS), International Federation for Information Processing (iFiP).
Information
Conference Manager
General Chair
Jürgen Teich, Friedrich-Alexander-Universität Erlangen-Nürnberg, DE
Contact Jürgen Teich
Programme Chair
Franco Fummi, Universita' di Verona, IT
papers@date-conference.com
To receive DATE's newsletter you may subscribe to the mailing list at the website: https://www.date-conference.com/user/register/ (upper right corner)
Submitted by Anonymous
on
Design, Automation, and Test in Europe (DATE 2019)
The European Event for Electronic Design and Test
The 22nd DATE conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems, covering ICs/SoCs, reconfigurable hardware and embedded systems, and embedded software.
The five-day event consists of a conference with plenary invited papers, regular papers, panels, hot-topic sessions, tutorials and workshops, two special focus days and a track for executives. The scientific conference is complemented by a commercial exhibition showing the state-of-the-art in design and test tools, methodologies, IP and design services, reconfigurable and other hardware platforms, embedded software, and (industrial) design experiences from different application domains, e.g. automotive, wireless, telecom and multimedia applications. The organisation of user group meetings, fringe meetings, a university booth, a PhD forum, vendor presentations and social events offers a wide variety of extra opportunities to meet and exchange information on relevant issues for the design and test community. Special space will also be allocated for EU-funded projects to show their results.
The Conference
The conference addresses all aspects of research into technologies for electronic and (embedded) systems engineering. It covers the design process, test, and tools for design automation of electronic products ranging from integrated circuits to distributed large-scale systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecom, wireless communications, multimedia, healthcare and automotive systems. Persons involved in innovative industrial designs are particularly encouraged to submit papers to foster the feedback from design to research. Panels, hot-topic sessions and embedded tutorials highlight and inform about emerging topics.
Special Days in the programme will focus on two areas bringing new challenges to the system design community:
Embedded meets Hyperscale and HPC: Heterogeneous computing with multiple, specialized processors and application-specific accelerators is vital for embedded systems to meet performance, latency, and efficiency targets. The same goals of fast, efficient, and cost-effective processing are also gating factors for the evolution of hyperscale data centre (DC) and high-performance computing (HPC) and Moore’s law no longer provides the necessary efficiency gains. Hence, we can witness a spread of technologies pioneered in embedded systems to hyperscale DCs and HPC systems, e.g., the use of specialized computing resources, massive parallelism, model-driven and domain-specific programming, task models, co-scheduling, and others. The theme of this special day is to highlight this confluence of methods and technologies to better understand, how heterogeneous computing is shaping the future of hyperscale DCs and HPC.
Model-Based Design of Intelligent Systems: The complexity of today’s cyber-physical systems is already enormous, but the rise of intelligent systems will further accelerate the design complexity. Good models and associated design processes are needed to keep the development under control and deliver high-quality systems in time. Modelbased design places models at the centre of the development cycle. It has successfully been used to develop embedded systems, starting from models in well-defined modelling formalisms, that can be analysed and from which software and hardware realizations can be automatically generated. This special day will explore all that is needed to lift model-based design into the era of intelligent systems. The special day will address, among other things, model-based design frameworks for IoT systems, modelbased machine learning, and application of model-based design in safety-critical and autonomous systems. The special day will also highlight the upcoming challenges in this domain to invite the DATE community to help to overcome them.
On the first day of the DATE event, half-day in-depth technical tutorials are given by leading experts in their respective fields. The Monday Tutorials are well suited for researchers, tool developers and system designers.
Friday Workshops concentrate on specialised and novel topics.
The Exhibition
The vivid accompanying exhibition states a unique networking opportunity for vendors of tools and services for hardware and embedded software for the design, development and test of Systems-on-Chip, IPs, Embedded Systems, ASICs, FPGAs and PCBs. Furthermore, it states the perfect venue for industries to meet university professors to foster their university programme and especially for PhD Students to meet their future employers.
A full programme in the Exhibition Theatre will again combine presentations by exhibiting companies, best-practice reports by industry leaders on their latest design projects and selected conference special sessions.
The full list of participating exhibitors and sponsors including their company profiles can always be found online: https://www.date-conference.com/exhibitors-sponsors
Topic Areas for Submission
Within the scope of the conference, the main areas of interest are organised in the following tracks. Submissions can be made to any of the track topics.
Track D: Design Methods and Tools, addresses design automation, design tools and hardware architectures for electronic and embedded systems. The emphasis is on methods, algorithms, and tools related to the use of computers in designing complete systems. The track’s focus includes significant improvements on existing design methods and tools as well as forward-looking approaches to model and design future system architectures, design flows, and environments.
Track A: Application Design, is devoted to the presentation and discussion of design experiences with a high degree of industrial relevance, real-world implementations, and applications of specific design and test methodologies. Contributions should illustrate innovative or record-breaking designs, which will provide viable solutions in tomorrow’s silicon, embedded systems, and large-scale systems. In topic A8, there is the opportunity to submit 2-page papers that expose industrial research and practice.
This track is organised in the following topics:
- A1 Power-efficient and Sustainable Computing
- A2 Robotics and Industry 4.0
- A3 Automotive Systems and Smart Energy Systems
- A4 Augmented Living and Personalized Healthcare
- A5 Secure Systems, Circuits, and Architectures
- A6 Self-adaptive and Learning Systems
- A7 Applications of Emerging Technologies
- A8 Industrial Experiences Brief Papers
Track T: Test and Dependability, covers all test, design-for-test, relia bility, and designfor-robustness issues, at system-, chip-, circuit-, and device-level for both analogue and digital electronics. Topics of interest also include diagnosis, failure mode analysis, debug and post-silicon validation challenges, and test or fault injection methods addressing system security.
This track is organised in the following topics:
- T1 Modeling and Mitigation of Defects, Faults, Variability, and Reliability
- T2 Test Generation, Test Architectures, Design for Test, and Diagnosis
- T3 Microarchitecture-Level Dependability
- T4 System-Level Dependability
- DT5 Design and Test for Analog and Mixed-Signal Circuits and Systems, and MEMS
- DT6 Design and Test of Secure Systems
Track E: Embedded and Cyber-Physical Systems, is devoted to the modelling, analysis, design and deployment of embedded software or embedded/cyber-physical systems. Areas of interest include methods, tools, methodologies and development environments. Emphasis will also be on model-based design and verification, embedded software platforms, software compilation and integration, real-time systems, cyberphysical systems, networked systems, and dependable systems.
This track is organised in the following topics:
- E1 Real-time and Dependable Systems
- E2 Embedded Systems for Deep Learning
- E3 Model-Based Design, Verification and Security for Embedded Systems
- E4 Embedded Software Architecture, Compilers and Tool Chains
- E5 Cyber-Physical Systems Design
- In addition to the above conference tracks, we welcome proposals for Special Sessions, Monday Tutorials, and Friday Workshops, and submissions for the Special Days on Designing Electronics for the Internet of Things Era and Designing Wearable Electronics and Smart Medical Devices.
Committees
Click the links below for a full list of the executive and programme committee members:
Sponsors
The event is sponsored by the European Design and Automation Association, the Electronic System Design (ESD) Alliance, the IEEE Council on EDA, ECSI, ACM – SIGDA, and RAS.
In cooperation with IEEE Computer Society Test Technology Technical Council (TTTC), IEEE Solid-State Circuits Society (SSCS), International Federation for Information Processing (iFiP).
Information
Conference Manager
General Chair
Jürgen Teich, Friedrich-Alexander-Universität Erlangen-Nürnberg, DE
Contact Jürgen Teich
Programme Chair
Franco Fummi, Universita' di Verona, IT
papers@date-conference.com
To receive DATE's newsletter you may subscribe to the mailing list at the website: https://www.date-conference.com/user/register/ (upper right corner)