8th International Embedded Systems Symposium (IESS) 2024
Important Dates
- Paper Submissions: July 14, 2024
- Acceptance of Notifications: July 30, 2024
- Camera Ready Papers: August 14, 2024
- Symposium Dates: October 14-16, 2024
Over recent years, embedded systems have gained an enormous amount of processing power and functionality.
Computing-intensive tasks (e.g., Artificial Intelligence, deep learning, and forecasting/prediction algorithms) are being increasingly embedded into these systems as the amount of processing and storage resources increases.
Many of the formerly external components can now be integrated into a single System-on-Chip.
This tendency has resulted in a dramatic reduction in the size and cost of embedded systems.
As a unique technology, the design of embedded systems is an essential element of many innovations in modern society.
Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements and its expected services.
Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever-demanding customer requirements and needs.
Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly and timely.
Embedded system designers have to cope with multiple goals and constraints simultaneously, including timing, power, reliability, dependability, maintenance, packaging, and, last but not least, price.
The significance of these constraints varies depending on the application area a system is targeted for. Typical embedded applications include multimedia, automotive, aerospace, medical and communication devices, robotics, and many others.
The goals of the International Embedded Systems Symposium are to present, exchange and discuss the state of the art, novel ideas, actual research results, and future trends in the field of embedded systems.
Contributors and participants from both industry and academia are encouraged to take an active part in this symposium.
Topics of Interest:
- Design methods and tools for embedded systems design
- Novel and dedicated architectures for embedded systems (IoT, deep learning, etc)
- Challenges on moving architectures to the edge of clouds
- Application specific processors: architectures, design tools and HW/SW Co-design
- Processing/Communication trade-offs at architectural level
- Domain Specific languages
- MDE methods and languages targeting embedded systems design at different abstraction levels
- Case studies of innovative Embedded Systems
- Reconfigurable architectures and applications
- Low power processing and communication architectures
- Embedded Systems Applications: Automotive, Avionic, Medical, Internet-of-Things (IoT), Industry 4.0, Smart Cities, Smart Grids, Computer Vision, Intelligent Systems
- Real-time challenges for embedded systems and systems-of-systems
- Human Machine Interface techniques and methods tailored for Embedded Systems
- Security issues for embedded and real-time systems
- Societal challenges and its impact on the engineering of embedded systems
Submission
The Proceedings will be published by Springer, the official publisher of IFIP. IMPORTANT: Springer changed the layout for the IFIP series. Full details on how to format your paper can be found at the web site of the conference publisher Springer. Springer will contact you if the paper is not in the proposed layout. Accepted full papers have a page limit of 12 pages, short papers of 10 pages. Again, please make sure to use the right paper style.
- All submitted papers will follow a blind review process.
- The Proceedings will be published by Springer, the official publisher of IFIP.
- Submission page: https://easychair.org/my/conference?conf=iess2024
Organizing Committee
General Chairs
Marco Aurelio Wehrmeister, Federal University of Technology (UTFPR), Brazil
Stefan Henkler, Applied University of Hamm-Lippstadt, Germany
Program Chairs
Marcio Kreutz, Federal University of Rio Grande do Norte (UFRN), Brazil
Tim Schattkowsky, University of Applied Sciences Hamm-Lippstadt, Germany
Local Chairs
Christophe Bobda, University of Florida, USA
Publicity Chairs
Marcelo Götz, Federal University of Rio Grande do Sul (UFRGS), Brazil
Financial chair
Achim Rettberg, Univ. of Applied Science Hamm/Lippstadt & Carl von Ossietzky University Oldenburg
Web Chair:
Charles Steinmetz, University of Applied Sciences Hamm-Lippstadt, Germany
Program Committee (Tentative):
Achim Rettberg – Hella Electronics & Carl von Ossietzky University Oldenburg, Germany
Andreas Gerstlauer – University of Texas Austin, USA
Andy Pimentel - University of Amsterdam, Netherlands
Antonio Carlos Schneider Beck Filho - Federal University of Rio Grande do Sul, Brazil
Carlos Pereira – Federal University of Rio Grande do Sul, Brazil
Carsten Homburg – dSPACE, Germany
Cesar Albenes Zeferino, University of Vale do Itajaí, Brazil
Charles Steinmetz – University of Applied Sciences Hamm-Lippstadt, Germany
Christophe Bobda – University of Arkansas, USA
Edison Pignaton de Freitas – Federal University of Rio Grande do Sul, Brazil
Flavio R. Wagner – Federal University of Rio Grande do Sul, Brazil
Florian Dittmann – STABIL GROUP International GmbH, Germany
Hiroyuki Tomiyama – Ritsumeikan University, Japan
Jose Lima - Polytechnic Institute of Braganca, Portugal
Jürgen Becker – University Karlsruhe, Germany
Kim Grüttner – OFFIS, Germany
Kristian Rother - University of Applied Sciences Hamm-Lippstadt, Germany
Luigi Carro – Federal University of Rio Grande do Sul, Brazil
Marcelo Götz – Federal University of Rio Grande do Sul, Brazil
Marcio Kreutz – Federal University of Rio Grande do Norte, Brazil
Marcio Oyamada - UNIOESTE, Brazil
Marco Aurelio Wehrmeister, Federal University of Technology (UTFPR - Brazil) & University of Münster (Germany)
Masahiro Fujita – University of Tokyo, Japan
Michael Amann – ZF Friedrichshafen, Germany
Michael Huebner – Ruhr-University Bochum, Germany
Michel Dos Santos Soares - Federal University of Sergipe - Brazil
Monica Magalhães Pereira, Federal University of Rio Grande do Norte, Brazil
Paula Herber, University of Münster, Germany
Rainer Doemer – University of California at Irvine, USA
Stefan Henkler – University of Applied Science Dortmund, Germany
Thomas Lehmann – HAW Hamburg, Germany
Uwe Honekamp – Vector Informatik, Germany
Wolfgang Schröder-Preikschat - Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany
Important Dates
- Paper Submissions: July 14, 2024
- Acceptance of Notifications: July 30, 2024
- Camera Ready Papers: August 14, 2024
- Symposium Dates: October 14-16, 2024
Over recent years, embedded systems have gained an enormous amount of processing power and functionality.
Computing-intensive tasks (e.g., Artificial Intelligence, deep learning, and forecasting/prediction algorithms) are being increasingly embedded into these systems as the amount of processing and storage resources increases.
Many of the formerly external components can now be integrated into a single System-on-Chip.
This tendency has resulted in a dramatic reduction in the size and cost of embedded systems.
As a unique technology, the design of embedded systems is an essential element of many innovations in modern society.
Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements and its expected services.
Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever-demanding customer requirements and needs.
Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly and timely.
Embedded system designers have to cope with multiple goals and constraints simultaneously, including timing, power, reliability, dependability, maintenance, packaging, and, last but not least, price.
The significance of these constraints varies depending on the application area a system is targeted for. Typical embedded applications include multimedia, automotive, aerospace, medical and communication devices, robotics, and many others.
The goals of the International Embedded Systems Symposium are to present, exchange and discuss the state of the art, novel ideas, actual research results, and future trends in the field of embedded systems.
Contributors and participants from both industry and academia are encouraged to take an active part in this symposium.
Topics of Interest:
- Design methods and tools for embedded systems design
- Novel and dedicated architectures for embedded systems (IoT, deep learning, etc)
- Challenges on moving architectures to the edge of clouds
- Application specific processors: architectures, design tools and HW/SW Co-design
- Processing/Communication trade-offs at architectural level
- Domain Specific languages
- MDE methods and languages targeting embedded systems design at different abstraction levels
- Case studies of innovative Embedded Systems
- Reconfigurable architectures and applications
- Low power processing and communication architectures
- Embedded Systems Applications: Automotive, Avionic, Medical, Internet-of-Things (IoT), Industry 4.0, Smart Cities, Smart Grids, Computer Vision, Intelligent Systems
- Real-time challenges for embedded systems and systems-of-systems
- Human Machine Interface techniques and methods tailored for Embedded Systems
- Security issues for embedded and real-time systems
- Societal challenges and its impact on the engineering of embedded systems
Submission
The Proceedings will be published by Springer, the official publisher of IFIP. IMPORTANT: Springer changed the layout for the IFIP series. Full details on how to format your paper can be found at the web site of the conference publisher Springer. Springer will contact you if the paper is not in the proposed layout. Accepted full papers have a page limit of 12 pages, short papers of 10 pages. Again, please make sure to use the right paper style.
- All submitted papers will follow a blind review process.
- The Proceedings will be published by Springer, the official publisher of IFIP.
- Submission page: https://easychair.org/my/conference?conf=iess2024
Organizing Committee
General Chairs
Marco Aurelio Wehrmeister, Federal University of Technology (UTFPR), Brazil
Stefan Henkler, Applied University of Hamm-Lippstadt, Germany
Program Chairs
Marcio Kreutz, Federal University of Rio Grande do Norte (UFRN), Brazil
Tim Schattkowsky, University of Applied Sciences Hamm-Lippstadt, Germany
Local Chairs
Christophe Bobda, University of Florida, USA
Publicity Chairs
Marcelo Götz, Federal University of Rio Grande do Sul (UFRGS), Brazil
Financial chair
Achim Rettberg, Univ. of Applied Science Hamm/Lippstadt & Carl von Ossietzky University Oldenburg
Web Chair:
Charles Steinmetz, University of Applied Sciences Hamm-Lippstadt, Germany
Program Committee (Tentative):
Achim Rettberg – Hella Electronics & Carl von Ossietzky University Oldenburg, Germany
Andreas Gerstlauer – University of Texas Austin, USA
Andy Pimentel - University of Amsterdam, Netherlands
Antonio Carlos Schneider Beck Filho - Federal University of Rio Grande do Sul, Brazil
Carlos Pereira – Federal University of Rio Grande do Sul, Brazil
Carsten Homburg – dSPACE, Germany
Cesar Albenes Zeferino, University of Vale do Itajaí, Brazil
Charles Steinmetz – University of Applied Sciences Hamm-Lippstadt, Germany
Christophe Bobda – University of Arkansas, USA
Edison Pignaton de Freitas – Federal University of Rio Grande do Sul, Brazil
Flavio R. Wagner – Federal University of Rio Grande do Sul, Brazil
Florian Dittmann – STABIL GROUP International GmbH, Germany
Hiroyuki Tomiyama – Ritsumeikan University, Japan
Jose Lima - Polytechnic Institute of Braganca, Portugal
Jürgen Becker – University Karlsruhe, Germany
Kim Grüttner – OFFIS, Germany
Kristian Rother - University of Applied Sciences Hamm-Lippstadt, Germany
Luigi Carro – Federal University of Rio Grande do Sul, Brazil
Marcelo Götz – Federal University of Rio Grande do Sul, Brazil
Marcio Kreutz – Federal University of Rio Grande do Norte, Brazil
Marcio Oyamada - UNIOESTE, Brazil
Marco Aurelio Wehrmeister, Federal University of Technology (UTFPR - Brazil) & University of Münster (Germany)
Masahiro Fujita – University of Tokyo, Japan
Michael Amann – ZF Friedrichshafen, Germany
Michael Huebner – Ruhr-University Bochum, Germany
Michel Dos Santos Soares - Federal University of Sergipe - Brazil
Monica Magalhães Pereira, Federal University of Rio Grande do Norte, Brazil
Paula Herber, University of Münster, Germany
Rainer Doemer – University of California at Irvine, USA
Stefan Henkler – University of Applied Science Dortmund, Germany
Thomas Lehmann – HAW Hamburg, Germany
Uwe Honekamp – Vector Informatik, Germany
Wolfgang Schröder-Preikschat - Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany