3D Security: Trustworthy System Security Through 3D Integrated Hardware

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ABSTRACT
This project is investigating a novel approach to trustworthy system development based on 3D integration, an emerging chip fabrication technique in which two or more integrated circuit dies are combined into a single stack using vertical conductive posts. Since the dies may be manufactured separately, 3D circuit integration offers the option of enhancing a commodity processor with a variety of custom security functions, which are manufacturing options applicable only to those systems that require them. This research introduces a fundamentally new method to incorporate security mechanisms into hardware and has the potential to significantly shift the economics of trustworthy systems.

Award ID: 0910734

  • Cryptographic Hardware
  • embedded systems
  • Hardware-Oriented Security and Trust
  • Naval Postgraduate School
  • Trustworthy System Development
  • UC San Diego
  • UC Santa Barbara
  • 0910734
  • SaTC PI Meeting 2012
  • Poster
  • Academia
  • SaTC Posters
Submitted by Katie Dey on Tue, 10/30/2012 - 15:31