Applications of CPS technologies used in manufacturing.
The timely and accurate in-service identification of faults in mechanical structures, such as airplanes, can play a vitally important role in avoiding catastrophes. One major challenge, however, is that the sensing system relies on high frequency signals, the coordination of which is difficult to achieve throughout a large structure. To tackle this fundamental issue, the research team will take advantage of 3D printing technology to fabricate integrated sensor-structure components. Specifically, the team plans to innovate a novel printing scheme that can embed piezoelectric transducers (namely, sensor/actuator coupled elements) into layered composites. As the transducers are densely distributed throughout the entire structure, they function like a nerve system embedded into the structure. Such a sensor nerve system, when combined with new control and command systems and advanced data and signal processing capability, can fully unleash the latest computing power to pinpoint the fault location.
The new framework of utilizing emerging additive manufacturing technology to produce a structural system with integrated, densely distributed active sensing elements will potentially lead to paradigm-shifting progress in structural self-diagnosis. This advancement may allow the acquisition of high-quality, active interrogation data throughout the entire structure, which can then be used to facilitate highly accurate and robust decision-making. It will lead to intellectual contributions including: 1) development of a new sensing modality with mechanical-electrical dual-field adaptivity, that yields rich and high-quality data throughout the structure; 2) design of an additive manufacturing scheme that inserts piezoelectric micro transducer arrays throughout the structure to enable active interrogation; and 3) formulation of new data analytics and inverse analysis that can accurately identify the fault location/severity and guide the fine-tuning of the sensor system.
Off
University of Connecticut
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National Science Foundation
Chengyu Cao
The timely and accurate in-service identification of faults in mechanical structures, such as airplanes, can play a vitally important role in avoiding catastrophes. One major challenge, however, is that the sensing system relies on high frequency signals, the coordination of which is difficult to achieve throughout a large structure. To tackle this fundamental issue, the research team will take advantage of 3D printing technology to fabricate integrated sensor-structure components. Specifically, the team plans to innovate a novel printing scheme that can embed piezoelectric transducers (namely, sensor/actuator coupled elements) into layered composites. As the transducers are densely distributed throughout the entire structure, they function like a nerve system embedded into the structure. Such a sensor nerve system, when combined with new control and command systems and advanced data and signal processing capability, can fully unleash the latest computing power to pinpoint the fault location.
The new framework of utilizing emerging additive manufacturing technology to produce a structural system with integrated, densely distributed active sensing elements will potentially lead to paradigm-shifting progress in structural self-diagnosis. This advancement may allow the acquisition of high-quality, active interrogation data throughout the entire structure, which can then be used to facilitate highly accurate and robust decision-making. It will lead to intellectual contributions including: 1) development of a new sensing modality with mechanical-electrical dual-field adaptivity, that yields rich and high-quality data throughout the structure; 2) design of an additive manufacturing scheme that inserts piezoelectric micro transducer arrays throughout the structure to enable active interrogation; and 3) formulation of new data analytics and inverse analysis that can accurately identify the fault location/severity and guide the fine-tuning of the sensor system.
Off
Georgia Institute of Technology
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National Science Foundation
Ben Wang
Event
SPIE 2017
CALL FOR PAPERS
SPIE 2017 conference on Cyber Physical Systems
May 8-10, 2017 | Barcelona, Spain | http://spie.org/EMT/conferencedetails/cyber-physical-systems
Event
CAIRES 2016
1st workshop on "Collaboration of Academia and Industry for Real World Embedded Systems" (CAIRES)
at Embedded Systems Week (ESWeek)
The objective of the workshop is to bring together researchers and engineers in order to find ways to solve some of the most pressing, and yet underestimated problems in the design of complex embedded systems:
(a). How to transfer appropriately abstracted, yet-not-trivialized problem statements from industry to research;
Event
ICECCS 2016
21st International Conference on Engineering of Complex Computer Systems (ICECCS 2016)
Overview
The President's Council of Advisors on Science and Technology report recommends ways |
Event
RSP 2016
27th IEEE International Symposium on Rapid System Prototyping (RSP 2016)
as part of ESWeek
The 14th Overture Workshop
7 November 2016 | Cyprus, Greece | http://overturetool.org/workshops/14th-Overture-Workshop.html
co-located with The Formal Methods Europe Symposium 2016
INTRODUCTION
Event
SOCNE 2016
CALL FOR PAPERS - Submission deadline May 20, 2016
Workshop on Service-Oriented Cyber-Physical Systems in Converging Networked Environments (SOCNE 2016)
in conjunction with ETFA 2016
Berlin, Germany | 23-27,September 06-09, 2016 | http://www.socne.org
Selected Topics
Event
FISP 2016
The Second International Workshop on Future Information Security, Privacy and Forensics for Complex systems (FISP 2016)
In Conjunction with the 11th International Conference on Future Networks and Communications (FNC'16)
Topics of Interest: